- Quick turn 7 days 8 layer 5mm board thickness
- 【Brief】：Material: High TG, high thermal conductivity material
Medium thickness: ≥0.09mm
Inner copper thickness: ≤18 OZ
Highest level: 24 Layers
Features: thick copper step technology
A variety of surface treatments
Hole filling plating and stack structure
Sheet and surface smoothness requirements - 【Series】：FR4 PCB
1.Details
Type: TG170 Heavy cooper heavy gold 8L FR4 PCB
Place of Origin: Guangdong, China
Brand Name: LDES
Base Material: FR4/ High TG FR-4/Rogers/Aluminum
Copper Thickness: 1 - 4oz
Board Thickness: 0.2 - 4mm
Min. Hole Size: 0.15mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Surface treatment: HASL, OSP, ENIG, Immersion Tin, Lead-free HASL
minimum solder resist opening: 1.5mil
minimum solder resist bridge: 3mil
maximum aspect Ratio: 10:01
impedance control accuracy: ±8%
maximum board size: 630*1100mm
maximum layer: 12
Certificate: ISO14001, ISO9001, TS16949, ROHS,UL
2.Capability
item
General time
1-2 Layers
4 days
4-6 Layers
6 days
8-10 Layers
8 days
12-16 Layers
12 days
18-20 Layers
14 days
22-26 Layers
16 days
PCB Prototype Lead Time:
Quick Turn
1 days
2 days
3 days
4 days
5 days
6 days
Note: Base on all data received by us and must be complete and problem free, Lead time is ready to ship.
3. FR4 Related PCB Board
4. Workshop
5. Certificates
